Surface treatment and tribology
Which statement correctly describes electroless nickel plating (Ni-P plating)?
- AAs in electroplating, it becomes thick at corners and edges where current concentrates and hardly deposits deep inside holes, so it is unsuited to parts of complex shape
- BBecause it contains phosphorus it never becomes amorphous, and heat treatment at about 400 °C drives out the phosphorus and softens it
- CIt deposits autocatalytically via a reducing agent without external power, so it coats complex shapes almost uniformly and hardens on heat treatment
Show answer and explanation
Answer: C. It deposits autocatalytically via a reducing agent without external power, so it coats complex shapes almost uniformly and hardens on heat treatment
In electroless nickel plating, hypophosphite in the bath reduces nickel ions, and the deposited nickel itself catalyzes the reaction so that growth continues. Because it is not governed by current distribution, it deposits with uniform thickness inside holes and on parts of complex shape, and with suitable pretreatment it can even plate nonconductors such as plastics. The deposit contains a few to over ten percent phosphorus, and high-phosphorus deposits are amorphous. Heat treatment at about 400 °C precipitates Ni₃P and raises the hardness from about 500 HV to about 900–1000 HV. Thickening at corners and edges and poor coverage deep in holes are properties of electroplating, which passes a current. Heat treatment does not drive out the phosphorus and soften the deposit.