What is Thermal barrier coating?

A ceramic coating of low thermal conductivity applied to the surface of high-temperature components. It consists of a zirconia top coat and a bond coat, and greatly lowers the metal temperature.

Japanese name: 遮熱コーティング

Thermal barrier coating appears in 3 practice questions across 1 topic, including High-temperature materials and creep.

Field: High-temperature materials and creep

Try it: questions about Thermal barrier coating

Which statement about the structure of a thermal barrier coating (TBC) applied to gas turbine blades is correct?

  1. ABeneath a low-conductivity zirconia (YSZ) top coat lies a bond coat such as MCrAlY, and a thin Al₂O₃ thermally grown oxide (TGO) forming at their interface protects the substrate from oxidation
  2. BThe top coat is dense, highly conductive alumina that quickly carries heat out of the blade to cool the metal, while the bond coat absorbs the thermal expansion mismatch with the substrate
  3. CThe YSZ top coat lets no oxygen through at all, so no bond coat is needed, and YSZ sprayed directly onto the substrate blocks both oxidation and heat
Show answer and explanation

Answer: A. Beneath a low-conductivity zirconia (YSZ) top coat lies a bond coat such as MCrAlY, and a thin Al₂O₃ thermally grown oxide (TGO) forming at their interface protects the substrate from oxidation

A TBC is a coating that lowers the metal temperature with an insulating surface layer while the inside of the blade is cooled by cooling air. The YSZ (yttria partially stabilized zirconia) top coat has a low thermal conductivity of about 1 to 2 W/(m·K) and, for a ceramic, a large thermal expansion coefficient. It is made as a porous sprayed coating or a columnar vapor-deposited coating to relieve the strain from the thermal expansion mismatch with the substrate. YSZ conducts oxide ions well and cannot stop oxygen, so Al in the bond coat oxidizes to form a thin Al₂O₃ TGO, which protects the substrate from oxidation. When the TGO thickens or undergoes thermal cycling, the top coat spalls from near it, which is the main factor limiting the life. A material with high thermal conductivity cannot serve as insulation.

A heat flux of 1.0 MW/m² passes uniformly through the thickness of the top coat of a thermal barrier coating (thickness 250 µm, thermal conductivity 1.2 W/(m·K)). Treating it as steady one-dimensional heat conduction, which is closest to the temperature difference between the two faces of the top coat?

  1. AAbout 300 K
  2. BAbout 21 K
  3. CAbout 208 K
Show answer and explanation

Answer: C. About 208 K

From Fourier's law q = kΔT/L, ΔT = qL/k = (1.0×10⁶ × 250×10⁻⁶)/1.2 ≈ 208 K. That a coating only about 0.25 mm thick can lower the metal temperature by about 200 K is the benefit of a thermal barrier coating. The creep strength of nickel-based superalloys is sensitive to temperature, so this temperature difference strongly affects the life and the allowable gas temperature. About 300 K multiplies by the thermal conductivity instead of dividing, and about 21 K converts the thickness as 25 µm, an order of magnitude too small. The lower the thermal conductivity and the thicker the coating, the larger the temperature difference, but thicker coatings spall more easily under thermal stress, so the thickness is limited.

Thermal barrier coating in the explanations

Questions that mention Thermal barrier coating (3)

  1. Which statement about the structure of a thermal barrier coating (TBC) applied to gas turbine blades is correct?
  2. A heat flux of 1.0 MW/m² passes uniformly through the thickness of the top coat of a thermal barrier coating (thickness 250 µm, thermal conductivity 1.2 W/(m·K)). Treating it as steady one-dimensional heat conduction, which is closest to the temperature difference between the two faces of the top coat?
  3. Which statement about the protective scales on heat-resistant alloys used in air at high temperatures above 1000 °C is correct?

Related terms

Nickel-based superalloy Coefficient of linear thermal expansion Creep Thermal stress Deformation mechanism map Diffusion creep Larson–Miller parameter Parabolic rate law Pilling–Bedworth ratio Power-law creep

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